SP-57000U
Product Description
SP-57000U is a translucent 70 durometer low temperature phenyl silicone giving excellent low temperature properties below -100C. SP-57000U has the typical damping characteristics of a phenyl silicone elastomer. It can be formulated to meet any of the MIL and aerospace specification requirements.
Product Features
- SP-57000U is also designed with excellent process characteristics and can be blended with SP-53000U to obtain various hardnesses while maintaining performance characteristics.
Brittle point @ -130F / -54C - no cracks
Typical Applications
- Applications requiring low temperature.
Typical Properties
Type of HCR
Low Temperature
Cure Agent
DCBP Paste (50%)
Cure Agent B
DBPH Paste (33%)
Tensile Strength (psi)
1300
Press Cure/Post Cure
Press/Post
Post Cure Temp. (°F)
350.6
Ratio of Catalyst to Material
1.2 : 100
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.