TC-TAP-2 Series

Shin-Etsu Silicones of America, Inc.

Product Features

  • High thermal conductivity
  • 0.11mm thickness available
  • Excellent electrical properties
  • Superior strength and hardness
  • UL 94 V-0 flame rated

Typical Applications

  • Vehicle inverters/converters
  • Power Transistors
  • Power Modules
  • LED Modules

Typical Properties

TypeHigh Hardness Thermal Pads
Low Molecular Weight Siloxane Stripped?Y
Density @ 23C (g/cm3)1.90
Shore A Hardness90
Tensile Strength (MPa)37.00
Dielectric Strength (kV/mm)91.0
Thermal Conductivity (W/m·K)1.80
Thermal Resistance (mm2·K/W)190
Usable Temp. Range (C)-40 to +180
Thickness (mm)0.11
Reinforced LayerPolyimide
Sheet Size (mm)320 x 1000 or 320 x 50m

Note: Values are not for specification purposes.

Physical properties are typical for the thickness given. Other thicknesses may have slightly varying properties and are available upon request.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.