PCS-PL-30
Shin-Etsu Silicones of America, Inc.
800-544-1745
Product Description
Shin-Etsu's PCS-PL-30 is a thermally conductive phase-change material designed to conform to the substrates that it is applied to. PCS-PL-30 exhibits excellent thermal conductivity and adhesion to metal and graphite substrates.
Product Features
- Conforms to substrate after application of heat
- Excellent thermal conductivity
- Thermal resistance minimization due to conformation to substrates
- High tackiness
- Excellent pump-out resistance
Typical Applications
- Vehicle inverters/converters
- Power modules
- LED modules
Typical Properties
Type | Phase Change Material |
Color | White |
Density @ 23C (g/cm3) | 2.70 |
Dielectric Strength (kV/mm) | 6.0 |
Thermal Conductivity (W/m·K) | 1.70 |
Thermal Resistance (mm2·K/W) | 73 |
Softening Point | 50 |
Thickness (mm) | 0.120 |
Reinforced Layer | Polyimide |
Bond Line Thickness (μm) | 30 |
Sheet Size (mm) | 320 x 400 |
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.