TC-PEN3-10
Product Description
The TC-PEN series is a reduced density material that maintains the same thermal conductivity and handleability as conventional pads. Suitable for cooling of in-vehicle equipment and other parts that require weight reduction.
Product Features
- Asker C hardness 10
- UL V-0 Equivalent rating
- Available in a variety of thicknesses from .5mm to 5.0mm
Typical Applications
- Large area parts such as lithium-ion batteries
- Devices with non-uniform surfaces.
Typical Properties
Type
Soft and Ultra Soft Thermal Pads
Density @ 23C (g/cm3)
2.60
Dielectric Strength (kV/mm)
16.0
Thermal Conductivity (W/m·K)
3.20
Sheet Size (mm)
300mm x 400mm
Note: Values are not for specification purposes.
Physical properties are typical for the thickness given. Other thicknesses may have slightly varying properties and are available upon request.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.