Product Description

Shin-Etsu's KE-4967 is a UL-94 V-0 equivalent, single component, room temperature cured product that acts as a thermal interface gap filler and provides high thermal conductivity and excellent electrical properties. KE-4967 has high natural tackiness to anchor itself to necessary substrates but develops no chemical adhesion to allow for superior reworkability.

Product Features

  • High thermal conductivity
  • Excellent electrical properties
  • UL-94 V-0 equivalent flame rating
  • Superior reworkability

Typical Applications

  • ECUs
  • PCU inverters
  • Transistors

Typical Properties

Liquid-dispensed Gap Filling Rubber
Cure Type
One/Two Component
Density @ 23C (g/cm3)
Viscosity (Pa·s)
Cure Conditions
7days @ 23C/50% RH
Tack Free Time (min)
Shore A Hardness
Tensile Strength (MPa)
% Elongation
Thermal Conductivity (W/m·K)
Usable Temp. Range (C)
-40 to +180
Bond Line Thickness (μm)

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use. Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.


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