Shin-Etsu Silicones of America, Inc.

Product Description

Shin-Etsu's KE-3491 is a single component, room-temperature cure, thixotropic adhesive that will cure to a tough, durable elastomer and exhibits high electrical conductivity. KE-3491 is a low odor, neutral cure, non-corrosive product that exhibits excellent, unprimed adhesion to metals, plastics, glass, and ceramics. For higher electrical conductivity, see KE-3492.

Product Features

  • Electrically conductive
  • Single component
  • Room-temperature cure
  • Thixotropic paste
  • Low odor and non-corrosive

Typical Applications

  • Form-in-place EMI shielding applications

Typical Properties

Cure TypeCondensation
One/Two ComponentOne
Density @ 23C (g/cm3)1.09
Cure Conditions7days @ 23C/50% RH
Tack Free Time (min)3
Shore A Hardness48
Tensile Strength (MPa)3.00
% Elongation310
Shear Strength (MPa)1.40
Volume Resistivity (Ω·cm)80
Usable Temperature Range (C)-40 to +180

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.