KE-1300T/CAT-1300

Shin-Etsu Silicones of America, Inc.
800-544-1745

Product Description

Shin-Etsu's KE-1300T/CAT-1300 is a high strength, high modulus mold making/potting compound of the addition polymerization type. KE-1300T/CAT-1300 exhibits excellent tear resistance, low shrinkage and easy release making it an excellent mold making material.

Product Features

  • High tensile strength
  • Excellent tear resistance
  • 10:1 mix ratio
  • Low shrinkage
  • Easy release

Typical Applications

  • Mold making applications requiring high strength molds

Typical Properties

TypeMold Making
Cure TypeAddition
One/Two ComponentTwo
ColorTranslucent
Density @ 23C (g/cm3)1.07
Viscosity Base (Pa·s)75.00
CatalystCAT-1300
Mix Ratio by weight100:10
Cure Conditions24hr @ 23C
Working Time1.5 Hours
Shore A Hardness40
Tensile Strength (MPa)5.50
Tear Strength (kN/m)18.00000
% Elongation400
Usable Temperature Range (C)-40 to +175

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.