X-832-299 A/B
Product Description
Shin-Etsu's X-832-299 is a two part dimetyl-polysiloxane based potting gel that will cure to form a soft pliable elastomer to protect sensitive electronic components. This material has adhesion to most substrates including aluminum, stainless steel, chromium, copper, nickel, brass, iron glass and ceramics. Tinted colors make this material easy to preform visual inspection to ensure proper mixing.
Product Features
- Superior vibration resistance
- Excellent electrical insulation
- Dual component, 1:1 mix ratio
- Room-temperature cure
- Pigmented for easy inspection
Typical Properties
Mix Ratio by weight
100:100
Cure Conditions
24hr @ 23C
Volume Resistivity (Ω·cm)
2x1015
Dielectric Strength (kV/mm)
20
Dielectric Constant
2.7 @ 50Hz
Dielectric Dissipation Factor
60
Thermal Conductivity (W/m·K)
0.16
Usable Temperature Range (C)
-40C to +200C
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.