Shin-Etsu's SMP-5008 PGMEA is a single component, heat cure primer that will cure to form an elastomeric layer that aides in bonding epoxy molding resins to metal lead frames for LED applications. SMP-5008 PGMEA is diluted with propylene glycol monomethylether acetate, which is driven off during the first two steps of the curing process.
- Exceptional adhesion between epoxy resins and metal lead frames
- Low elastic modulus to relieve stress from epoxy resins
- Single component
- Heat cure
- Primer for increasing adhesion between epoxy molding resins and metal lead frames
Density @ 23C (g/cm3)
Propylene Glycol Monomethyether Acetate
Tensile Strength (MPa)
Volume Resistivity (TΩ·m)
Dielectric Strength (kV/mm)
2.5 @ 50Hz
Dielectric Dissipation Factor
3.4 x 10-3 @ 50Hz
Coefficient of Linear Expansion α1 (ppm)
Usable Temperature Range (C)
-40 to +180
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.