SMP-2840

Typical Properties

Type
LED Die-Bond Adhesive
Cure Type
Addition
One/Two Component
One
Color
Gray
Density @ 23C (g/cm3)
5.60
Viscosity (Pa·s)
30.00
Solvent
Polyethylene glycol dimethyl ether
Cure Conditions
1.5hr @ 180C
Thermal Conductivity (W/m·K)
1.00
Thermal Resistance (C/W)
8
Softening Point (C)
185
Coefficient of Linear Expansion α1 (ppm)
40
Coefficient of Linear Expansion α2 (ppm)
160
% Volatile Content
14.00

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use. Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.

SMP-2840

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