SES22450-20
Product Description
Shin-Etsu's SES22450-20 is a silicone coating / encapsulating material that is formulated to offer outstanding insulation performance over a wide range of temperatures (-40C to 200C). The material exhibits good adhesion to most printed circuit board substrates including FR4 and ceramic surfaces upon exposure to heat. The SES22450-20 will resist yellowing over time and exposure to an outdoor environment.
Product Features
- Long pot life, 12 days at 23C
- Adhesion to a wide variety of substrates
- Self priming adhesion
- Non-Yellowing, Optically Clear
- Low Viscosity, Flowable/Sprayable
- UL 746(c)
Typical Properties
Density @ 23C (g/cm3)
1.02
Cure Conditions
30min @ 150C
Tensile Strength (psi)
330
Volume Resistivity (Ω·cm)
8x1014
Dielectric Strength (kV/mm)
20
Dielectric Dissipation Factor
7 x 10-4
Refractive Index (23C/589nm)
1.41
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.