SES22254/CAT22254-55

Product Description

Shin-Etsu's SES22254/CAT22254-55 is a high strength, high modulus mold making/potting compound of the addition polymerization type. SES22254/CAT22252-55 exhibits good tear resistance, high Shore A durometer, low shrinkage and easy release making it an excellent mold making material for urethane foams and other organic plastic resins.

Product Features

  • High Durometer
  • Excellent tensile and tear strength
  • Suitable for urethane foam systems
  • 10:1 mix ratio
  • Easy Release

Literature

Typical Properties

Type
Mold Making
Cure Type
Addition
One/Two Component
Two
Color
Red
Density @ 23C (g/cm3)
1.17
Viscosity Base (Pa·s)
100.00
Catalyst
CAT22254-55
Mix Ratio by weight
100:10
Cure Conditions
24hr@23C
Working Time
4 Hours
Shore A Hardness
50
Tensile Strength (MPa)
4.60
Tear Strength (kN/m)
14
% Elongation
180
Usable Temperature Range (C)
-40 to +180

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use. Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.

SES22254/CAT22254-55

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