MR-COAT-02F
Product Description
The MR-COAT-02F is a one part, fast room temperature cure, silicone resin based system for use in conformal coating applications of printed circuit boards. Material, exhibits superior elongation compared to standard silicone resin based products for less stress on the PCB components. Material also uses a safe solvent as the diluent. Material can be sprayed, dipped, or brush coated.
Product Features
- One component
- Room temperature cure (Alcohol)
- Low viscosity
- Suitable for spraying, dipping, brushing and flow coating
- Non-corrosive property to general metals
- Good for moisture/water-proof coating on PCB
- Excellent electrical properties
- UV-tracer for easy inspection
Typical Applications
Literature
Typical Properties
Cure Conditions
7 days 23C 50%RH
Tensile Strength (MPa)
3.00
Dielectric Strength (kV/mm)
27
Dielectric Dissipation Factor
.002
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.