KE-200
Product Description
Shin-Etsu's KE-200 is a dual component, UL 94 HB rated, room-temperature cure, low viscosity potting encapsulant that will cure to form a durable, flexible rubber to protect electronic components. KE-200 exhibits excellent electrical insulation, deep section cure, and adhesion to metals, plastics, glass, and ceramics.
Product Features
- Quick deep section cure
- UL 94 HB certified
- Dual component
- Room-temperature cure
- Low viscosity
Typical Applications
- Potting junction boxes for photovoltaics
Literature
Typical Properties
Low Molecular Weight Siloxane Stripped?
Y
Density @ 23C (g/cm3)
1.01
Mix Ratio by weight
100:10
Cure Conditions
72hr @ 23C
Tensile Strength (MPa)
0.50
Volume Resistivity (TΩ·m)
60
Dielectric Strength (kV/mm)
26
Dielectric Constant
2.9 @ 50Hz
Dielectric Dissipation Factor
3x10-3 @ 50Hz
Thermal Conductivity (W/m·K)
0.21
Usable Temperature Range (C)
-40 to +180
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.