Product Description

Shin-Etsu's KE-1310ST/CAT-1310 is a high strength, high modulus mold making/potting compound of the addition polymerization type with additional platinum catalyst to overcome inhibition issues. KE-1310ST/CAT-1310 exhibits excellent tear resistance, low shrinkage and easy release making it an excellent mold making material.

Product Features

  • High platinum levels to overcome inhibition
  • High tensile strength
  • Excellent tear resistance
  • Low shrinkage
  • 10:1 mix ratio
  • Easy release

Typical Applications

  • Mold making applications requiring high strength molds


Typical Properties

Mold Making
Cure Type
One/Two Component
Density @ 23C (g/cm3)
Viscosity Base (Pa·s)
CAT 1310
Mix Ratio by weight
Cure Conditions
24hr @ 23C
Working Time
2 Hours
Shore A Hardness
Tensile Strength (MPa)
Tear Strength (kN/m)
% Elongation
Usable Temperature Range (C)
-40 to +175

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use. Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.


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