Shin-Etsu's Liquid Dispensed Thermal Adhesives combine the functionality of a silicone adhesive with that of a thermally conductive interface material. They act as thermally conductive glues between heat dissipating components and heat sinks. They are used in numerous electronics applications including Automotive Engine Control Unit & Power Control Unit cooling and LED lighting.
The adhesives are provided as one or two part materials and are electrically isolating.
Our one part materials have the following curing options:
- Addition cure - requiring heat to cure. Includes materials: KE-1862, KE-1867 and KE-1891.
- Condensation cure - requiring humidity from the air to cure while generating a small amount of cure byproduct. Includes materials: KE4961W, KE-4962 and KE-3467.
Our two part materials are mixed with a 1 to 1 ratio and have the following curing options:
- Addition cure - requiring heat to cure. Includes materials KE-1897-A/B and KE-1898-A/B.
- Addition cure - will cure at room temperature. Includes X-32-3292-A/B