High-hardness Thermal Pads

Thermal Interface Materials Made From Silicone Rubber Pads

Shin-Etsu's High-hardness Pads are Thermal Interface Materials made from silicone rubber pads with fillers to enhance heat dissipation while providing electrical isolation.

Utilized in many applications including conducting heat from components such as power transistors or circuit boards to heat sinks.

They are reinforced with fiberglass or Polyimide film for increased dieletric strength.

Available in sheet form or roll form that can be die cut to specific shapes. Additional forms available including Cap or Tube shapes to fit over components.

Product Specifications
TIM High Hardness Thermal Pads
Schematic Diagram
Sheet Schematics
Cap Schematics
Thermal grease on CPU
Contact Us
Shin-Etsu Silicones of America, Inc.
1150 Damar Drive
Akron, Ohio 44305-1201

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