KR-251
Product Description
KR-251 is a rapid cure, medium hardness silicone resin. It forms a thin, hard coating when cured on surfaces, and has low compatibility with organic resins. KR-251 also absorbs very little moisture and retain high volume resistivity over from 25-200°C, which makes it useful in protecting electronic components.
Product Features
- Rapid cure speed
- Medium hardness
- Low compatibility with organic resins
- Forms a thin, hard coating
- Absorbs very little moisture
- Dielectric properties independent of temperature
- High volume resistivity over a wide temperature range (25-200°C)
Typical Applications
- Moisture proofing and insulating coatings. Electrical component protection.
Literature
Typical Properties
Product type (taxonomy term)
Resins and Oligomers
Specific Gravity @ 25°C
0.920
Volatile Content
80%, 105°C x 3h
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.