Shin-Etsu Silicones of America, Inc.

Product Description

This general purpose base line has easy processing. It can be used in a variety of applications. It can be molded, extruded or calendared.

Product Features

  • This product can be blended with the rest of the Shin-Etsu general purpose base or any no post cure bases for intermediate properties. The choice between these bases will depend on the specific requirements for each application.

Typical Properties

Type of HCRGeneral Purpose
Cure AgentDBPH Paste (33%)
Tensile Strength (psi)1710
Elongation (%)779
100% Modulus141
Specific Gravity1.18
Tear Die B (ppi)227
Compression Set (%)11
Comp. Set Time (hours)22
Comp. Set Temp. (°C)177
Comp. Set Temp. (°F)350.6
Press Cure/Post CurePress/Post
Cure Time (minutes)10
Cure Temp. (°C)177
Cure Temp. (°F)350.6
Post Cure Time (hours)4
Post Cure Temp. (°C)200
Post Cure Temp. (°F)392
Ratio of Catalyst to Material1.2 : 100

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.