Product Description

SV-16002U is one of a series of easy processing, general purpose silicone rubber bases. It can be used in a variety of applications requiring finishing by molding, extruding or calendaring.

Product Features

  • This product can be blended with other Shin-Etsu general purpose or no post cure bases for intermediate properties. The choice between these bases will depend on specific requirements. This product can also be extended with extending fillers.

Typical Applications

  • Roll covers.
  • Diaphragms.
  • O-rings and gaskets.

Typical Properties

Type of HCR
General Purpose
Cure Agent
DBPH Paste (33%)
Tensile Strength (psi)
Elongation (%)
100% Modulus
Specific Gravity
Tear Die B (ppi)
Cure Time (minutes)
Cure Temp. (°C)
Cure Temp. (°F)
Post Cure Time (hours)
Post Cure Temp. (°C)
Post Cure Temp. (°F)
Ratio of Catalyst to Material
1.2 : 100

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use. Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.


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