KEG-2097-50 A/B
Product Description
KEG-2097-50 A/B is a self-bonding and low-molecular-siloxane reduced liquid injection molding silicone. KEG-2097-50 A/B bonds to plastic, polycarbonate, PBT. It is supplied as two components which are mixed 1:1 ratio to ensure easy and accurate blending. The viscosity of KE-2097-50 A/B is low enough to allow easy pumping through most injection molding systems.
Product Features
- Excellent self-bonding to plastics, polycarbonate, PBT
- Reduced low-molecular-siloxane
- Rapid cure time at elevated temperature
- Long pot life at room temperature
Typical Applications
- Healthcare devices, cushions, diaphragms, connector packing, applications that require food grade materials.
Packaging Information
20 kg pail kits and 200 kg drum kits
Typical Properties
Type of HCR
Select Hesive LIMS
Tensile Strength (psi)
1580
Note: Values are not for specification purposes.
Storage and Shelf Life
Store in a cool, dry place.
Regulatory Testing
FDA Certification
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.